News
The newly released EEPROM IP is designed for SPD modules, a critical component in modern memory systems widely used in DDR and LPDDR memory modules. The SPD stores essential parameters such as ...
From leading semiconductor companies to forward-looking consumer electronics brands, Ceva customers can now leverage Elliptic Labs’ AI Virtual Smart Sensor Platform™, a full-stack AI software solution ...
AI has a memory problem. Traditional SRAM and DRAM were never designed to meet the scale and intensity of today’s AI workloads – and their limitations in power, bandwidth and density are slowing ...
The FFT4T core is a multi-stream FFT Core, implementing a complex FFT and IFFT simultaneously over many multiplexed data streams. The core performs demultiplexing for convenience of the filtering ...
Transition or slew is the delay taken by a signal to rise from logic “0” to “1” or to fall from logic “1” to “0”. Transition ...
The newly developed UCIe PHY IP supports up to 32 transmit and receive channels, delivering an impressive data transfer rate of up to 512Gbps (56GB/s). This IP is designed to meet the demanding ...
Andes Technology, the leading provider of high-performance, low-power RISC-V processor IP, today announced the release of AndeSight™ IDE v5.4. This latest version significantly accelerates AI and ...
Enabling robust, power-efficient design and faster time-to-market for next generation devices ...
“The Titanium suite allows AV professionals to build powerful, standards-based IP installations with minimal latency and maximum image fidelity,” said Gauthier Thieren, Product owner of the Titanium ...
VeriSilicon (688521.SH) today announced that its ultra-low energy and high-performance Neural Network Processing Unit (NPU) IP now supports on-device inference of large language models (LLMs) with AI ...
Coupled with our Silicon Lifecycle Management IP, OEMs can assess real-time silicon health metrics such as voltage, ...
Qualcomm Inc has agreed to acquire Alphawave IP Group plc, a London-listed semiconductor company, in a US$2.4 billion all-cash deal aimed at strengthening its position in high-speed connectivity chips ...
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