Flurry of regulation and fundings in U.S.; Chinese blacklist expands; materials report; new 3D interconnect process control; ...

This will be an incredible year for innovation, driven by AI and for AI, and pushing the limits of fundamental physics.

The hardware choices for AI inference engines are chips, chiplets, and IP. Multiple considerations must be weighed.

The fourth quarter of 2024 saw five mega-rounds of over $100 million. One of the hottest areas continues to be AI hardware, with one company developing RISC-V AI processor IP bringing in nearly $700 ...

From large TSVs for MEMS to nanoTSVs for backside power delivery, cost-effective process flows for these interconnects are essential for making 2.5D and 3D packages more feasible. Through-silicon vias ...

Global semiconductor sales hit $57.8 billion in November 2024, an increase of 20.7% compared to the same month last year, according to the Semiconductor Industry Association. Special Report: What’s ...

As the semiconductor industry continues its relentless march towards smaller process nodes and more complex integrated circuits (ICs), the challenge of ensuring reliability has become increasingly ...

At Rambus, we often receive RFIs, RFPs and RFQs for security silicon IP cores to be used in our customer’s next semiconductor product. Such requests often contain a long shopping list of required ...

The ISO 26262 standard, which has become a mainstay since the trend toward vehicle electrification really took root a decade ago, is starting to gain traction in markets outside of automotive chip and ...

Security is beginning to improve for a wide range of IoT and edge devices due to better tools, the implementation of new standards and methodologies, and an increasing level of collaboration and ...

This latest edition of the power & sensing selection guide compares our products’ key benefits and the latest power and sensing technology advancements to find what you need for your designs.

The U.S. Department of Energy will contribute $179 million for three new Microelectronics Science Research Centers, which will focus on research into solutions that bridge sensing, edge processing, AI ...