Flurry of regulation and fundings in U.S.; Chinese blacklist expands; materials report; new 3D interconnect process control; ...

A new technical paper titled “Monolithic 3D FPGAs Utilizing Back-End-of-Line Configuration Memories” was published by ...

A new technical paper titled “Where Do the Electrons Go? Studying Loss Processes in the Electrochemical Charging of ...

Global semiconductor sales hit $57.8 billion in November 2024, an increase of 20.7% compared to the same month last year, according to the Semiconductor Industry Association. Special Report: What’s ...

The fourth quarter of 2024 saw five mega-rounds of over $100 million. One of the hottest areas continues to be AI hardware, with one company developing RISC-V AI processor IP bringing in nearly $700 ...

The Electronic Design Automation (EDA) industry is a mature industry, but it’s also one that is constantly changing. Each process node and packaging technology advancement places new demands and ...

In an era where system complexity is scaling rapidly, real-time monitoring and predictive analytics play a pivotal role in maintaining lifetime performance and reliability. At proteanTecs, we are ...

From large TSVs for MEMS to nanoTSVs for backside power delivery, cost-effective process flows for these interconnects are essential for making 2.5D and 3D packages more feasible. Through-silicon vias ...

Advanced IC substrates (AICS) have been marching toward the 2µm line/space (L/S) redistribution layer (RDL) technology node for some time (figure 1). However, many questions remain about the ability ...

In an era where system complexity is scaling rapidly, real-time monitoring and predictive analytics play a pivotal role in maintaining lifetime performance and reliability. At proteanTecs, we are ...

Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...

Security is beginning to improve for a wide range of IoT and edge devices due to better tools, the implementation of new standards and methodologies, and an increasing level of collaboration and ...